Telius 305 SCCM SE Oxide

The Tokyo Electron Telius 305 SCCM SE Oxide is a semiconductor etch system. Tokyo Electron manufactures the Telius 305 SCCM SE Oxide. The equipment belongs to the Etch equipment category. The model designation is Telius 305 SCCM SE. The Telius 305 SCCM SE Oxide is an oxide etch tool.^[1][2]

Plasma etch systems process wafers in a low-pressure chamber containing a carefully controlled gas mixture. Radio-frequency power applied to the chamber ionizes the gas and sustains a plasma. The plasma supplies chemically reactive species that attack the exposed oxide, while energetic ions provide directional bombardment. Vacuum pumps remove volatile reaction products and maintain the process pressure. Oxide etching generally relies on reactive-ion-etch chemistry, in which radical chemistry and ion bombardment act together.

Oxide etch systems operate after photolithography has defined the pattern to be transferred. Etch tools remove dielectric films from areas not protected by the patterned resist. Oxide etching creates contact holes, vias, and trenches in dielectric layers. After etching, wafers typically move to resist strip and wet-clean steps before subsequent deposition or metallization.

Oxide etch systems are applied to silicon dioxide and other dielectric films. Typical applications include contact and via etching, interlayer dielectric patterning, and hardmask opening. Dielectric etch also forms trench isolation structures and spacer features in transistor fabrication.