Tokyo Electron
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Tokyo Electron A 303 i LPCVD is a low pressure chemical vapor deposition system used for thin-film deposition in semiconductor manufacturing.[1][2]
An LPCVD system forms solid films from chemical precursors in a low pressure process environment.
A deposition furnace or reactor of this class typically exposes many substrates to process gases at the same time.
The A 303 i LPCVD is used after prior wafer preparation steps and before downstream patterning or integration steps that use the deposited film.
LPCVD equipment is used to deposit thin films for semiconductor devices and related microfabrication structures.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the A 303 i LPCVD are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the A 303 i LPCVD are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the A 303 i LPCVD are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the A 303 i LPCVD are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the A 303 i LPCVD are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the A 303 i LPCVD are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Last updated Oct 4, 2026.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.