Waferpedia

SUSS MicroTec

HP8 / CP8 / VP8

200mmSUSS MicroTec HP8 / CP8 / VP8 family
Research Quality: 40% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

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What it is

The HP8, CP8, and VP8 are manual coating and developing systems that process substrates up to 200 mm in diameter.[1]

The HP8, CP8, and VP8 support baking, cooling, and vapor priming process steps.[1]

How it works

The HP8, CP8, and VP8 are manual systems that combine baking, cooling, and vapor priming capabilities in a single platform.[1]

Where it fits in the process flow

The HP8, CP8, and VP8 are used for coating and developing process steps, which are part of the lithography sequence in semiconductor and microsystems fabrication.[1]

Applications

The HP8, CP8, and VP8 are used in coating and developing applications that involve baking, cooling, and vapor priming.[1]

What do the numbers mean?

Wafer handling1

Wafer size
up to 200 mm[1]
Accurate?

Configuration & options2

System type
Manual[1]
Accurate?
Processes
Baking, Cooling, Vapor Priming[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

Are the HP8, CP8, and VP8 manual or automated systems?

The HP8, CP8, and VP8 are manual systems.[1]

What process steps do the HP8, CP8, and VP8 support?

The HP8, CP8, and VP8 support baking, cooling, and vapor priming.[1]

Not publicly documented

The following facts about the HP8 / CP8 / VP8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the HP8 / CP8 / VP8 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the HP8 / CP8 / VP8 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the HP8 / CP8 / VP8 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the HP8 / CP8 / VP8 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the HP8 / CP8 / VP8 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]hilpert.ch — hilpert.chhilpert.ch
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Last updated Sep 22, 2026.

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