Struers
RotoPol 31 Tabletop
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Struers RotoPol 31 is a tabletop grinder and polisher manufactured by Struers.[1]
What it is
How it works
Grinding and polishing on the RotoPol 31 are performed by rotating a sample against an abrasive disc mounted on the turntable. The user can adjust disc speed and water flow during operation. Optional disc cooling is available to control temperature.[2][3]
The machine supports the use of optional specimen movers such as the Rotoforce-3/4 or Pedemat/Pedemax-S to automate sample movement. Settings for speed, water, and disc cooling can be stored and recalled using an optional Rotocom memory unit.[2][3]
What do the numbers mean?
Power & electrical1
Configuration & options9
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage / frequency3x200 V / 50 Hz; 3x200-210 V / 60 Hz; 3x220-230 V / 50 Hz[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What are the key consumables in a CMP process?General reference — not yet source-verified
The main consumables are the polishing pad (typically made of polyurethane or composite materials) and the chemical slurry, which contains abrasive particles (e.g., silica or ceria) and reactive chemicals. Both must be matched to the material being polished and the desired removal rate and selectivity.
What factors affect removal rate and uniformity?General reference — not yet source-verified
Removal rate depends on downforce, platen speed, slurry composition, pad condition, and substrate hardness. Uniformity is influenced by carrier design, pad conditioning, and the distribution of slurry across the wafer surface. Process optimization requires balancing these parameters.
Can CMP be used for materials other than silicon wafers?General reference — not yet source-verified
Yes, CMP is applied to a variety of substrates including compound semiconductors (GaAs, SiC), glass, sapphire, ceramics, and metal surfaces for optical and high‑precision components. The chemistry and abrasives are tailored to the specific material properties.
Not publicly documented
The following facts about the RotoPol 31 Tabletop are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the RotoPol 31 Tabletop are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the RotoPol 31 Tabletop are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the RotoPol 31 Tabletop are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the RotoPol 31 Tabletop are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the RotoPol 31 Tabletop is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]manualslib.com — manualslib.commanualslib.com
- [3]Struers RotoPol-31 Manuals | ManualsLib — manualslib.commanualslib.com
Last updated Oct 7, 2026.
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