SFT 9400 XRF

The Seiko Epson SFT 9400 XRF is an X-ray fluorescence (XRF) instrument. Seiko Epson is the manufacturer. The SFT 9400 XRF is categorized under Metrology & Inspection.^[1][2]

An X-ray fluorescence instrument irradiates the sample with a primary X-ray beam. The high-energy beam excites atoms in the material and ejects electrons from their inner atomic shells. Electrons from outer shells fill the vacancies, and the excess energy is emitted as fluorescent X-rays. The fluorescent spectrum is characteristic of the elements in the sample, so the peaks in the spectrum identify which elements are present.

Peak intensities in the fluorescent spectrum are proportional to the amount of each element in the analyzed volume. For layered structures, the attenuation of X-rays passing through overlying films provides information used to calculate the thickness of each layer. A measurement of this kind can determine both composition and thickness in the same scan.

X-ray fluorescence metrology instruments are used in semiconductor fabrication to measure metal film stacks, metal interconnects, and other thin-film layers. The inspection is normally performed after deposition, plating, or etch steps as a process control check. Results from such measurements support feedback to the equipment that formed the film, helping maintain target composition and thickness.

The same class of equipment is also used in back-end assembly and packaging work. In that setting, the instrument characterizes solder finishes, barrier and seed layers, and bonding surfaces. Because the technique does not damage the item being measured, product wafers, coupons, and finished components can be checked directly.

Applications of this class of equipment include measuring the composition and thickness of plated finishes such as nickel, gold, tin, and solder. X-ray fluorescence is also used to monitor barrier layers, seed layers, interconnects, and bond pads in semiconductor metallization.

The method detects foreign-material contamination and verifies alloy composition in metal films. XRF analysis is also applied in failure analysis laboratories and in quality control for printed circuit board and wafer-level packaging production.