Rigaku

The X-ray generating unit uses a sealed tube with a fixed anode and air cooling, providing a focal spot size of 5 μm. The system includes fixed filters of aluminium 1.0 mm and copper 0.1 mm and 0.2 mm. The detector is a semiconductor flat panel with an imaging area of 11.4 mm by 145.7 mm, a pixel size of 49.5 μm, and an array of 2352 by 2944 pixels, producing 14-bit images. The sample stage offers 140 mm of Z-axis travel, optional XY stages with ±3 mm range, and accepts sample boards of 130 mm or 200 mm diameter; the maximum field of view is 200 mm in diameter and 270 mm in height, with a sample load capacity of 5 kg. The X-ray source operates at 130 kV and 39 W.[1][2]
The CT Lab HX 130 provides adjustable source-to-object distance (SOD) and source-to-detector distance (SDD), enabling users to select between a high-resolution mode with a voxel size of 2.1 μm and a large-field-of-view mode covering 200 mm. The X-ray source voltage and current settings, as well as the beam filter, can be adjusted to optimize contrast and penetration for different sample materials and thicknesses.[2]
The CT Lab HX 130 is used in electronics to scan full circuit boards as well as individual components. In geology, it enables high-resolution imaging of rock interiors for mineralogical studies. For metallic parts, it provides both low-resolution full-part rendering for quality control and high-resolution scans to reveal voids and cracks in materials such as aluminium. In life science, it offers high-contrast imaging of plants, insects, and animal tissues.[2]
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Resolution depends on X-ray source spot size, detector pixel size, source-to-sample and sample-to-detector distances, and sample geometry. Class-level systems range from sub-micrometer for small samples to several micrometers for larger packages or assemblies.
Systems vary, but class-level tools typically accommodate samples from a few millimeters to several centimeters in diameter, with weight limits determined by the precision rotation stage and load capacity of the sample holder.
Calibration uses reference artifacts with known dimensions and geometries, such as ball bars or step gauges, to establish scale and distortion corrections. Manufacturers provide procedures for system geometry calibration and periodic verification using certified reference standards.
CT metrology is non-destructive, so samples typically require no preparation beyond mounting. However, very large or highly attenuating samples may need to be trimmed or reduced in size to achieve acceptable X-ray transmission. Samples must be fixed to the rotation stage to prevent movement during the scan.
The following facts about the CT Lab HX 130 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CT Lab HX 130 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CT Lab HX 130 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CT Lab HX 130 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CT Lab HX 130 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CT Lab HX 130 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 30, 2026.
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