Plasma-Therm
Versalock 700 ICP
The Plasma-Therm Versalock 700 ICP is an inductively coupled plasma etcher. The Versalock 700 ICP is a dual-chamber etcher. The Versalock 700 ICP is powered by 3-phase, 60 Hz, 208V electrical supply and includes 3 Edwards pumps and 2 Neslab chillers.[1][2][3][4]
What it is
How it works
General reference — not yet source-verifiedAn inductively coupled plasma etcher uses a plasma source to create reactive species that remove material from a substrate in a controlled dry-etch process.
Where it fits in the process flow
Applications
General reference — not yet source-verifiedICP etchers are used for anisotropic dry etching where directional material removal is important.
What do the numbers mean?
Power & electrical3
Vacuum & pumping2
- 3 Edward Pumps[1]
Control & software2
- Vortex Computer Update[1]
Configuration & options4
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Versalock 700 ICP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Versalock 700 ICP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Versalock 700 ICP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Versalock 700 ICP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Versalock 700 ICP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Versalock 700 ICP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Versalock 700 ICP — Plasma-Therm | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [4]Lam Research 2300 e 4 Kiyo MCX Metal vs Plasma-Therm Versalock 700 ICP comparison | Waferpedia — waferpedia.comwaferpedia.com
- [5]Plasma-Therm Versalock 700 ICP family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 8, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
