Palomar
8000 i
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Palomar 8000 i is a wire bonder and ball bumper. The Palomar 8000 i is a fully automated thermosonic high-speed, ball-and-stitch wire bonder. The Palomar 8000 i has a bond area of 304.8 x 152.4 mm (12" x 6").[1][2]
Power
upgraded to a 120kHz transducer[1]
Vacuum
-25 inHg (85 kPa)[2]
Performance
+/- 2.5 μm, 3σ[2]
Optics
0.10 μm X/Y axis[2]
What it is
General reference — not yet source-verifiedWire bonders make electrical interconnections between a die and its package or substrate by forming fine wire bonds at precise locations. A machine of this class is used in back-end assembly after device fabrication and before final package completion.
How it works
The Palomar 8000 i uses thermosonic ball and wire bonding. The machine also supports ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles.[2]
The Palomar 8000 i uses VisionPilot with Radar Referencing for part location and pattern recognition. The Palomar 8000 i also uses Bond Data Miner, i2Gi software, and a control system with linear motor, encoder, voice coil, and servo EFO elements.[2]
Where it fits in the process flow
The Palomar 8000 i fits in semiconductor and microelectronic assembly for packaging, component assembly, and interconnect formation. The machine is suited for complex hybrids, MCMs, high-reliability devices, optoelectronic packaging, chip-on-board work, system-in-package assemblies, specialty lead frames, automotive assemblies, flex circuits, and fine-pitch devices.[2]
Applications
The Palomar 8000 i is used for large complex hybrids, HB and HP LED arrays, optoelectronic packaging, chip-on-board assemblies, system-in-package assemblies, specialty lead frames, automotive assemblies, flex circuits, multi-chip modules, fine-pitch devices, and LEDs with running stitch.[2]
What do the numbers mean?
Power & electrical3
- upgraded to a 120kHz transducer[1]
Vacuum & pumping1
Wafer handling1
- Capabilities
- Ball bumping, stud bumping, wafer bumping, chip bumping, customized looping profiles[2]
Optics & imaging1
Performance1
Control & software1
- Control system
- Linear motor/encoder (X/Y), voice coil/encoder (Z linear / Z rotary), Servo EFO/encoder[2]
Dimensions & facilities4
Configuration & options17
- Applications
- Large complex hybrids, HB/HP LED arrays, optoelectronic packaging, chip-on-board (COB), system in packages (SiPs), specialty lead frames, automotive assemblies, flex circuits, multi-chip modules (MCMs), fine pitch devices, LEDs with running stitch[2]
Vintage & configurations
- 2013system debut[3]
Debut of the 8000i Wire Bonder/Ball Bumper.
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 8000i Wire Bonder/Ball Bumper | — | 2013 | Stated as the debut of the 8000i Wire Bonder/Ball Bumper. | web.archive.org[3] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Shinkawa UTC 5000— Same function class: Packaging & Bonding, nullCompare in depthsource[4]
- Besi DS 9000 E— Same function class: Packaging & Bonding, nullCompare in depthsource[5]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
When was the Palomar 8000i introduced?
The 8000i Wire Bonder/Ball Bumper debuted in 2013.[3]
What bond types does the 8000i support?
The 8000i performs thermosonic ball and wire bonding, ball bumping, stud bumping, wafer bumping, and chip bumping.[2]
What is the minimum wire pitch the 8000i can achieve?
The minimum wire pitch is 50 μm (0.0019 in) using 20 μm (0.00078 in) wire.[2]
What is the bond area of the 8000i?
The bond area is 304.8 × 152.4 mm (12 × 6 in).[2]
What cycle times does the 8000i achieve?
Cycle times are 0.125 sec/wire and 0.077 sec/bump.[2]
What vision system does the 8000i use?
The 8000i uses VisionPilot with Radar Referencing, an advanced geometric pattern-matching system that locates parts based on boundary curves rather than a traditional pixel grid.[2]
Not publicly documented
The following facts about the 8000 i are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the 8000 i are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8000 i are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8000 i is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 8000 i are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 8000 i are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]60069.fs1.hubspotusercontent-na2.net — 60069.fs1.hubspotusercontent-na2.net60069.fs1.hubspotusercontent-na2.net
- [3]web.archive.org — palomartechnologies.com (Jul 24, 2019)web.archive.org
- [4]web.archive.orgweb.archive.org
- [5]Equipment inventory listing
Last updated Oct 5, 2026.
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