Oxford Instruments
Plasmalab 133
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Oxford Instruments Plasmalab 133 is a deposition system in the Plasmalab family.[3]
How it works
General reference — not yet source-verifiedA plasma deposition tool uses an energized gas discharge to drive chemical reactions that form thin films on a substrate surface.
A PECVD system typically combines process gases, low-pressure plasma, and controlled chamber conditions to deposit material at relatively low substrate temperatures.
Where it fits in the process flow
General reference — not yet source-verifiedDeposition tools in this class are used after substrate preparation and before later patterning or integration steps.
PECVD equipment is commonly used to place functional thin films into a process flow for insulation, passivation, or masking roles.
Applications
General reference — not yet source-verifiedPlasma deposition equipment is used for thin-film formation in semiconductor and microfabrication work.
What do the numbers mean?
Power & electrical5
Wafer handling2
Gas & chemistry2
Optics & imaging1
Control & software1
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What are the typical substrate size and compatibility?General reference — not yet source-verified
Deposition tools of this class are designed to handle standard wafer sizes and can also accommodate non-circular substrates, such as glass or ceramic pieces, with appropriate fixturing.
How does the deposition rate compare to other methods?General reference — not yet source-verified
The deposition rate in plasma-enhanced processes is generally moderate, optimized for uniform film growth rather than high throughput; it can be adjusted by changing process parameters like power and gas flow.
What are the common maintenance requirements for these systems?General reference — not yet source-verified
Routine maintenance includes cleaning the chamber interior to remove deposits, replacing consumable parts like showerheads or electrodes, and calibrating gas flow and vacuum systems to ensure consistent performance.
Not publicly documented
The following facts about the Plasmalab 133 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 133 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 133 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 133 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 133 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 133 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]waferpedia.com — waferpedia.comwaferpedia.com
- [4]asseta.comasseta.com
- [5]instrumenthive.cominstrumenthive.com
Last updated Oct 7, 2026.
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