Oxford Instruments
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
Ion beam deposition is typically used in semiconductor manufacturing for applications requiring high-quality films with low defect densities, such as for advanced interconnects, barrier layers, or optical coatings. The IBD process is often performed in a vacuum chamber and can be integrated into a cluster tool or used as a stand-alone system.
Common applications of ion beam deposition include the deposition of dielectric films, metal layers, and optical coatings for photonics, MEMS, and advanced packaging. The Oxford IBD Chamber is suited for these applications in research and production environments.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Oxford IBD Chamber (Ion Beam Deposition) with hollow cathode DC ion source | — | — | Listed with a hollow cathode DC ion source. | Equipment inventory listing[1] |
| Oxford IBD Chamber (Ion Beam Deposition) with RF gridded ion source | — | — | Listed with an RF gridded ion source. | Equipment inventory listing[2] |
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the IBD are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IBD are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the IBD are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IBD are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IBD is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the IBD are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Last updated Sep 30, 2026.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.