Orbotech
P 36 SPI
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedSolder paste inspection systems measure the geometry of solder paste deposits using non-contact optical sensing. A typical system projects a pattern of light onto the board and uses a camera to reconstruct the height of each paste deposit. The measured height, volume, and area are compared against programmed tolerances. Solder paste inspection systems classify each pad as acceptable, insufficient, or excessive. The inspection results provide feedback for stencil printing process control.
Where it fits in the process flow
General reference — not yet source-verifiedSolder paste inspection takes place after solder paste printing and before component placement. A solder paste inspection system of this type sits between the stencil printer and the placement machine in a surface-mount assembly line. The machine inspects boards while they are still at the print stage, so defects can be corrected before reflow soldering. The placement in the process flow allows paste printing problems to be isolated from other assembly steps.
Applications
General reference — not yet source-verifiedSolder paste inspection systems are used in the production of printed circuit boards and other electronic assemblies. The process is applied after solder paste printing to catch defects such as insufficient paste, excess paste, and paste bridging. Solder paste inspection is especially important for boards with fine-pitch components and high component density. The technique also supports process improvement by providing quantitative measurements of paste deposit geometry.
What do the numbers mean?
No specifications recorded yet
Be the first to add cited specifications for this tool.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the P 36 SPI are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the P 36 SPI are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 36 SPI are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the P 36 SPI are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the P 36 SPI are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the P 36 SPI are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]P 36 SPI — Orbotech | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 2, 2026.
Compare with similar tools
View all →The KLA .204 PSL Wafer is an 8-inch NIST-traceable reference wafer compatible with Surfscan 6xy0 and Sp1 particle counters.
KLA .496 PSL Wafer is an 8-inch NIST traceable wafer stated to be capable on Surfscan 6xy0 and SP1.
The KLA .498 PSL Wafer is a NIST traceable reference wafer.
