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The Gasonics L3500 is a plasma asher used for stripping photoresist. The Gasonics L3500 operates with O2 and N2 process gases. The Gasonics L3500 can be configured for wafer sizes from 4 to 12 inches.[1][2]
The Gasonics L3500 plasma system is designed for ashing and cleaning semiconductor wafers. The model L3500 is manufactured by Gasonics and is categorized as a plasma asher semiconductor process equipment. The system can be configured for wafer sizes including 12 inch, 8 inch, or 6 inch depending on the specific unit.[3][1][2]
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The L3500 can be configured for 12 inch, 8 inch, or 6 inch wafers depending on the system configuration.[3][1][2]
The Gasonics L3500 uses oxygen (O2) and nitrogen (N2) as process gases.[1][2]
The L3500 is a plasma asher designed for ashing and cleaning semiconductor wafers by removing photoresist using monatomic oxygen generated from a microwave plasma.[1][2]
Some units of the L3500 include a HINE Hatm 5.0 atmospheric robot arm upgrade.[2]
The following facts about the Gasonics L 3500 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Gasonics L 3500 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Gasonics L 3500 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Gasonics L 3500 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Gasonics L 3500 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Gasonics L 3500 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 24, 2026.
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