Waferpedia

Kulicke & Soffa

ConnX

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Kulicke & Soffa ConnX is a wire bonder. Variants of the ConnX include the ConnX LED and the CONNX ELITE OPTO.[1][2]

ConnX — Inventory photo
Fig. 01ConnXInventory photo[3]

What it is

The Kulicke & Soffa ConnX is a wire bonder used in packaging and bonding operations.[3][1]

How it works

General reference — not yet source-verified

Wire bonders feed a thin wire through a capillary tool, press the wire onto a bond pad, and use force with ultrasonic energy to form a metallurgical bond.

The tool then moves to a second bonding point, forms a wire loop, bonds again, and cuts the wire to complete the interconnect.

Where it fits in the process flow

The ConnX LED is positioned for multiple wire bonds on individual LED dies, with upstream die bonding and plasma cleaning and downstream encapsulation, testing, and singulation.[1]

Applications

The ConnX LED is used for solid-state lighting packaging.[1]

What do the numbers mean?

Configuration & options2

Equipment type
Wire Bonder[3]
Accurate?
Category
Packaging & Bonding[4]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
ConnX LED———waferpedia.com[1]
CONNX ELITE OPTO———semiconductor.directory[2]
Interested in this tool?
Need help with this tool?Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What kind of tool is the ConnX LED?

The ConnX LED is a wire bonder.[1]

What process does the ConnX LED support?

The ConnX LED supports packaging and bonding operations for LED dies.[1]

Not publicly documented

The following facts about the ConnX are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the ConnX are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ConnX are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the ConnX are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the ConnX are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the ConnX is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.com — waferpedia.comwaferpedia.com
  2. [2]semiconductor.directory — semiconductor.directorysemiconductor.directory
  3. [3]Inventory photo
  4. [4]waferpedia.comwaferpedia.com
Was this page accurate?

Last updated Oct 7, 2026.

Compare with similar tools

View all →