Kulicke & Soffa
8060
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA wire bonder joins fine conductive wire between a semiconductor die and a package or substrate to create electrical interconnects.
Wire bonding equipment typically positions the workpiece, forms a bond at one contact point, spans the wire to a second point, and forms the next bond to complete the interconnect.
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding belongs in the back-end assembly flow after die preparation and die attach.
Wire bonding usually precedes encapsulation or other package completion steps.
Applications
General reference — not yet source-verifiedWire bonders are used for semiconductor device packaging where die-to-package electrical connections are required.
Wire bonding supports packaged integrated circuits and other microelectronic assemblies that rely on fine interconnects.
What do the numbers mean?
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 8060 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8060 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 8060 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 8060 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8060 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8060 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
Last updated Oct 7, 2026.
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