Kulicke & Soffa
1488 Gold
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedGold wire bonders such as the 1488 Gold form electrical connections between the IC die and the leadframe or substrate using gold wire, a common interconnect technique in microelectronics packaging.
How it works
General reference — not yet source-verifiedA gold ball bonder like the 1488 Gold operates by feeding a fine gold wire through a capillary. A spark from an electronic flame-off system melts the wire tip to form a free-air ball, which is then thermosonically bonded to a bond pad on the die under a combination of ultrasonic energy, heat, and pressure.
After the first bond, the capillary moves to a second bond location on the package substrate, where a crescent or stitch bond is formed. The wire is then cut, and the process repeats to complete all required interconnections.
Where it fits in the process flow
General reference — not yet source-verifiedIn the semiconductor manufacturing flow, wire bonding occurs after wafer dicing and die attach, and before encapsulation or molding. The 1488 Gold is used in the packaging stage to connect the die to the external leads of the package.
Applications
General reference — not yet source-verifiedThe 1488 Gold is designed for ball bonding using gold wire, a process widely employed in IC packaging for devices requiring high reliability and fine-pitch interconnections.
Gold wire bonding is used in a variety of package types, including plastic dual in-line packages, small-outline packages, and other leadframe-based packages, as well as some substrate-based packages.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
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Not publicly documented
The following facts about the 1488 Gold are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 1488 Gold are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 1488 Gold are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 1488 Gold are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 1488 Gold are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 1488 Gold are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]1488 Gold — Kulicke & Soffa | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
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