Koh Young

KY 8080 3D

Q: What inspection principle does the KY 8080 3D use?

The KY 8080 3D uses 3D Shadow Free Moiré Camera Technology.

Q: What solder paste attributes does the KY 8080 3D measure?

The KY 8080 3D measures volume, area, height, offset, bridging, and shape deformity.

Q: Where does the KY 8080 3D fit in the SMT process flow?

The KY 8080 3D is used in-line to verify printed solder paste on a PCB before later assembly steps.

Q: What defects does the KY 8080 3D detect?

The KY 8080 3D detects insufficient paste, excessive paste, missing paste, bridging, shape deformity, and paste offset.

Metrology & Inspection

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The Koh Young KY 8080 3D is a metrology and inspection system for solder paste inspection in SMT assembly. The Koh Young KY 8080 3D uses 3D Shadow Free Moiré Camera Technology. The Koh Young KY 8080 3D measures solder paste volume, area, height, offset, bridging, and shape deformity.^[1]^[2]

Koh YoungKY 8080 3D

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Power

200 ~ 240VAC, 50/60 Hz Single phase^[2]

Performance

2 m m^[2]

Optics

3D Shadow Free Moiré Camera Technology^[2]

What it is

The Koh Young KY 8080 3D is a metrology and inspection system for solder paste inspection in SMT assembly.^[2]^[1]^[3]

How it works

The KY 8080 3D measures solder paste properties including volume, area, height, offset, bridging, and shape deformity.^[2]

Where it fits in the process flow

The KY 8080 3D is used as an in-line process control tool for verifying printed solder paste on a PCB before later assembly steps.^[2]

What do the numbers mean?

Power & electrical2

Supply electrical: 200 ~ 240VAC, 50/60 Hz Single phase^[2]
Power: 200 ~ 240VAC, 50/60 Hz Single phase^[1]

Optics & imaging4

Measurement principle: 3D Shadow Free Moiré Camera Technology^[2]2 sources
Camera: 2MPix^[2]2 sources
XY pixel resolution: 20 µm^[2]2 sources
Z resolution: 0.37 µm^[2]2 sources

Performance2

Volume repeatability: < 1% at 3 sigma (on a KY Calibration Target); < 3% at 3 sigma (on a PCB)^[2]2 sources
Height accuracy: 2 m m^[2]2 sources

Control & software2

Operating system: Windows XP Professiona^[2]
Operating system: Windows XP Professional^[1]

Dimensions & facilities7

Dimensions: 1000x1335x1627mm^[2]2 sources
Weight: 600kg^[2]2 sources
Inspection range: Volume, Area, Height, Offset, Bridging and Shape Deformity^[2]
Max paste height: 400 u m^[2]
Conveyor width adjustment: Automatic^[2]2 sources
Conveyor height: 970 ~ 870 mm^[2]2 sources
Max paste height: 400 µm^[1]

Configuration & options20

Equipment type: 3D Solder Paste Inspection^[1]
Category: Metrology & Inspection^[1]
Minimum component: 01005^[2]2 sources
PCB size: 350x330mm^[2]2 sources
Defects detected: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset^[2]
Inspection speed at 20 u m shadow free mode: 15.0 cm²/sec^[2]
Inspection speed at 20 u m high speed mode: 19.7 cm²/sec^[2]
Gage R&R: < 10% at 6 Sigma (± 50 tolerance)^[2]2 sources
Max PCB warp: ± 3.5 mm^[2]2 sources
Min paste deposit size at 20 u m rectangle: 150 u m^[2]
Min paste deposit size at 20 u m circle: 200 u m^[2]
Conveyor fix type: Front/Rear Fixed (Factory Setting)^[2]2 sources
Air: 5 Kgf/cm²^[2]2 sources
S/W statistical analysis tool: SPC Plus^[2]2 sources
Inspection program generation: Import GERBER Data (274X, 274D)^[2]2 sources
Options: Zoom Head (15, 20, 30 mm Autozoom); Off-line SPC & Defect Review Station; Off-line Programming Station; ODB++ File Conversion; Barcode Reader (1D/2D); HDD Raid 1 (Mirrored); Certified Calibration Target; UPS^[2]2 sources
Inspection speed at 20 µm shadow free mode: 15.0 cm²/sec^[1]
Inspection speed at 20 µm high speed mode: 19.7 cm²/sec^[1]
Min paste deposit size at 20 µm rectangle: 150 µm^[1]
Min paste deposit size at 20 µm circle: 200 µm^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Supply electrical200 ~ 240VAC, 50/60 Hz Single phase^[2]
Power200 ~ 240VAC, 50/60 Hz Single phase^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What inspection principle does the KY 8080 3D use?

The KY 8080 3D uses 3D Shadow Free Moiré Camera Technology.^[1]^[2]

What solder paste attributes does the KY 8080 3D measure?

The KY 8080 3D measures volume, area, height, offset, bridging, and shape deformity.^[1]^[2]

Where does the KY 8080 3D fit in the SMT process flow?

The KY 8080 3D is used in-line to verify printed solder paste on a PCB before later assembly steps.^[1]

What defects does the KY 8080 3D detect?

The KY 8080 3D detects insufficient paste, excessive paste, missing paste, bridging, shape deformity, and paste offset.^[1]^[2]

Not publicly documented

The following facts about the KY 8080 3D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the KY 8080 3D are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the KY 8080 3D are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the KY 8080 3D are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the KY 8080 3D are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the KY 8080 3D is not on record.
Answerable by: an OEM datasheet or a fab qualification report