KLA
OP 7341 XP Film Thickness Measurement
Wafer size
25 wafer load ports (Asyst) with robot transfer (2 paddies)
Power
Power Supply (check RP)[1]
Vacuum
Vacuum[1]
Optics
Separated optical table design[1]
What it is
General reference — not yet source-verifiedThe KLA OP 7341 XP Film Thickness Measurement System is a wafer film-thickness metrology tool for semiconductor manufacturing.
How it works
General reference — not yet source-verifiedFilm-thickness measurement systems in this class use optical metrology to determine thin-film properties from reflected light.
A film-thickness metrology tool is typically built to measure optical signatures from patterned or unpatterned wafers and convert those signals into thickness data for process control.
Where it fits in the process flow
General reference — not yet source-verifiedA film-thickness measurement system belongs in inline or at-line metrology after deposition or other film-forming steps and before later lithography or etch steps that depend on film quality.
Applications
General reference — not yet source-verifiedFilm-thickness metrology is used for semiconductor thin films that must be controlled for uniformity, target thickness, and stack integrity.
What do the numbers mean?
Power & electrical1
- Power Supply (check RP)[1]
Vacuum & pumping2
Wafer handling3
Optics & imaging4
Performance2
- Prealigner & full alignment using Vision Processing[1]
Control & software3
- Two user interface (Front & Read)[1]
Configuration & options16
- CD (1D & 2D features) & film stack measurement[1]
- External Server SuperGrendel for fast computation (168 cores)[1]
- Integrated Mini-Environment[1]
- SECS / GEM full capability[1]
- Auto-focus[1]
- Compressed Air[1]
- N2[1]
- Pedestal[1]
- HDD not included[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does the tool handle very thin films or films below a certain thickness?General reference — not yet source-verified
For very thin films where the optical path difference is small, the interference signal becomes weaker. Many instruments in this class incorporate advanced algorithms or use shorter wavelengths (e.g., ultraviolet light) to improve sensitivity. Some systems can measure films down to a few nanometers, although accuracy depends on the film's optical properties and the substrate. Very thin or absorbing films may require ellipsometry rather than standard reflectometry.
Can the tool measure multiple layers simultaneously?General reference — not yet source-verified
Yes, many modern film thickness measurement systems can characterize multi-layer stacks by fitting the entire measured reflectance spectrum to a model that includes all layers. The algorithm must be provided with the correct sequence and approximate optical constants for each layer. The number of layers that can be reliably extracted depends on the complexity of the stack and the spectral range of the instrument.
What are typical calibration requirements for this class of tool?General reference — not yet source-verified
Calibration typically involves measuring a reference standard with known thickness and optical constants, often a certified silicon wafer with a thermally grown oxide film. The tool's wavelength scale and intensity response are corrected using this standard. Periodic recalibration is recommended, and many systems include automated calibration routines. For best accuracy, the tool may also require purging or temperature stabilization to minimize drift.
Not publicly documented
The following facts about the OP 7341 XP Film Thickness Measurement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the OP 7341 XP Film Thickness Measurement are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the OP 7341 XP Film Thickness Measurement are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the OP 7341 XP Film Thickness Measurement are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the OP 7341 XP Film Thickness Measurement are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the OP 7341 XP Film Thickness Measurement is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]Equipment inventory listing
Last updated Oct 10, 2026.
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