EV Group
810
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedPlasma activation tools typically generate a plasma within a vacuum chamber using radio-frequency (RF) energy or microwave excitation. The plasma consists of ionized gases such as oxygen, argon, or nitrogen. Reactive species in the plasma interact with the substrate surface, creating functional groups or removing contaminants.
Where it fits in the process flow
General reference — not yet source-verifiedPlasma activation is often performed before wafer bonding, adhesive bonding, or photoresist coating to enhance surface energy. The step can be integrated into a batch process or single-wafer processing sequence.
In a semiconductor or MEMS fabrication line, plasma activation typically follows substrate cleaning and precedes the bonding or deposition step.
Applications
General reference — not yet source-verifiedCommon applications of plasma activation include silicon direct bonding, polymer bonding, surface cleaning, and preparation for microfluidic devices.
- Plasma activation
What do the numbers mean?
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 810 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 810 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 810 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 810 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 810 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 810 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]wiki.nanotech.ucsb.edu — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
- [2]Tool List - UCSB Nanofab Wiki — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
- [3]Tool List - UCSB Nanofab Wiki — wiki.nanofab.ucsb.eduwiki.nanofab.ucsb.edu
Last updated Oct 4, 2026.
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