Esec
2100
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Esec 2100 family includes die bonder and flip chip bonder variants. The Esec 2100 hS is a 300 mm high-speed platform. The Esec 2100 SSI is a 12-inch die bonder with a Soft Solder Indexer.[1][2][3]
What it is
The Esec 2100 SSI is a later addition to the 2100 family that integrates the Phi-Y Pick & Place concept with a Soft Solder Indexer for soft solder, diffusion soldering, and direct sintering processes.[2]
How it works
The Esec 2100 hS uses a revolutionary Phi-Y concept that combines rotational and linear movements for very short pick-and-place cycle times, and includes a light and rigid pick-and-place structure with advanced trajectory control and liquid cooling for high-speed accuracy.[1]
The system provides real-time process monitoring through four live images of the process zone, constant status control with real-time wafer, strip and magazine viewers, and context-sensitive online help for efficient learning and error recovery.[1]
The Esec 2100 SSI adds a dedicated real-time OS, closed-loop bond force control with up to 300 N optional force, eight programmable heater zones, and four programmable gas flow zones for precise atmosphere control in soft soldering and sintering applications.[2]
Where it fits in the process flow
The Esec 2100 family handles leadframes, substrates, and strips; the SSI variant specifically handles strips up to 300 mm by 102 mm, accommodating a wide range of package formats.[2]
Applications
The hS variant supports epoxy die attach for packages such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA.[1]
The SSI variant is designed for soft solder processes, diffusion soldering, and direct sintering, targeting high-power packages that require higher bond forces and controlled atmospheric conditions.[2]
What do the numbers mean?
Wafer handling4
Configuration & options2
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Esec 2100 FC | — | — | Flip chip bonder. | waferpedia.com[3] |
| Esec 2100 hS | 3rd generation | — | 300 mm high speed platform for epoxy die attach applications. | besi.com[1] |
| Esec 2100 SSI | — | — | 12-inch die bonder with a Soft Solder Indexer and support for soft solder, high force diffusion, and direct sintering processes. | besi.com[2] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the bonding accuracy of the Esec 2100 hS?
The Esec 2100 hS has a bonding accuracy of 20 µm at 3 sigma, with a 15 µm option available.[1]
What wafer sizes does the Esec 2100 hS support?
The Esec 2100 hS supports wafers from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.[1]
What is the cycle time of the Esec 2100 hS?
The cycle time of the Esec 2100 hS is 120 ms with the Liquid Cooling option.[1]
What is the maximum bond force of the Esec 2100 SSI?
The Esec 2100 SSI has a standard bond force range of 0.2 to 50 N, with an optional 300 N high-force option.[2]
What die sizes can the Esec 2100 hS handle?
The Esec 2100 hS can handle die sizes from 0.25 mm (with Small Die Kit) up to 20 mm.[1]
Not publicly documented
The following facts about the 2100 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2100 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2100 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2100 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2100 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]besi.com — besi.combesi.com
- [3]waferpedia.com — waferpedia.comwaferpedia.com
- [4]Equipment inventory listing
Last updated Oct 6, 2026.
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