Waferpedia

Electroglas

EG 3001 X

Test & ProbeElectroglas EG 3001 X family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Electroglas EG 3001 X is a wafer prober. The EG 3001 X supports 4-inch and 6-inch wafers.[1][2]

ElectroglasEG 3001 X
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What it is

The Electroglas EG 3001 X is a test and probe tool.[2]

The EG 3001 X is a wafer prober.[1][2]

How it works

General reference — not yet source-verified

A wafer prober positions semiconductor wafers so test contact can be made to devices or structures on the wafer surface.

A probe station class tool typically combines precision motion, wafer positioning, and electrical contact hardware for measurement and parametric testing at the wafer level.

Where it fits in the process flow

General reference — not yet source-verified

A wafer prober is used in wafer-level test and characterization before die singulation.

A wafer prober supports electrical verification and device probing during front-end semiconductor process flows.

Applications

General reference — not yet source-verified

A wafer prober is used for electrical test, probe-based measurement, and device characterization on semiconductor wafers.

A wafer prober is used in semiconductor test and probe work on devices fabricated on wafer surfaces.

What do the numbers mean?

Wafer handling2

Wafer Size
4 inch[1]
Accurate?
Wafer Size
6 inch[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the EG 3001 X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the EG 3001 X are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EG 3001 X are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the EG 3001 X are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the EG 3001 X are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the EG 3001 X are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]EG 3001 X — Electroglas | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 7, 2026.

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