Cascade Microtech
Summit 12861 B Semi-Automatic
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Cascade Microtech Summit 12861 B is a semi-automatic probe station. The station handles wafers of 8 inch size.[1]
How it works
General reference — not yet source-verifiedSemi-automatic probe stations are designed to position a wafer under a probe card and align the card's needles to the device under test. The station uses a motorized chuck to move the wafer in X, Y, and theta axes, and an optical alignment system to locate the first die. Once aligned, the station steps the chuck to each die site and electrically contacts the bond pads via the probe card. The system interfaces with a tester to measure device parameters across the wafer.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor manufacturing, probe stations are used in the wafer sort or probe test step, which occurs after wafer fabrication is complete and before dicing and packaging. During this step, each die on the wafer is electrically tested to identify functional devices and to measure performance. The results guide decisions on binning and yield improvement.
What do the numbers mean?
Wafer handling1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Summit 12861 B Semi-Automatic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Summit 12861 B Semi-Automatic are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Summit 12861 B Semi-Automatic are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Summit 12861 B Semi-Automatic are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Summit 12861 B Semi-Automatic are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Summit 12861 B Semi-Automatic are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Sep 30, 2026.
Compare with similar tools
View all →The KLA 1007 is a wafer prober manufactured by KLA.
The Electroglas 1034 Prober is a semiconductor wafer prober manufactured by Electroglas.
