Buehler
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The Buehler 49 7211 is a chemical mechanical polisher (CMP). The Buehler 49 7211 has 1 phase electrical input. The Buehler 49 7211 is specified for 170-264 Vac at 47/63 Hz.[1][2]

CMP tools combine chemical etching with mechanical abrasion to planarize wafer surfaces.
The process uses a rotating platen with a polishing pad and a controlled flow of abrasive slurry.
CMP is used for global planarization at multiple points in semiconductor fabrication.
Typical process steps where CMP is applied include interlayer dielectric planarization and metal damascene polishing.
CMP systems are used to planarize silicon wafers and other substrates used in semiconductor device manufacturing.
Applications include oxide polishing, copper polishing, and removing topographic variations on a wafer surface.
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The following facts about the 49 7211 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 49 7211 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 49 7211 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 49 7211 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 49 7211 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 49 7211 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 7, 2026.
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