ASM
LinDA
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM LinDA is a die bonder used in semiconductor packaging and bonding. The ASM LinDA Bonder operates at 200 VAC, single phase, 50/60 Hz.[1][2]
What it is
General reference — not yet source-verifiedThe ASM LinDA is a die bonder used in semiconductor packaging. A die bonder attaches individual semiconductor dies to a substrate or lead frame, typically as part of the assembly process after wafer dicing. The machine performs placement with precision alignment, often using vision systems to ensure accurate positioning.
How it works
General reference — not yet source-verifiedDie bonders of this class pick a die from a wafer or tape-and-reel feeder after it has been diced and separated. The machine applies a bonding agent, such as epoxy, solder paste, or a eutectic alloy, to the substrate or to the die backside. The die is then placed onto the target location with controlled force and temperature, as required by the specific bonding process.
Alignment is achieved through pattern recognition systems that locate fiducial marks on the substrate and features on the die. The bond head may use vacuum pickup or collet tools, and the stage moves in X, Y, and theta axes to correct placement errors. Some die bonders also support flip-chip bonding, where the die is inverted and its bumps contact the substrate pads directly.
What do the numbers mean?
Power & electrical4
- 50/60 Hz[1]
Configuration & options4
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| CM-LinDA | — | — | Variant designation for die bonder | dynamicmos.com[3] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Finetech Lambda— Same function class: Packaging & Bonding, nullCompare in depthsource[2]
- Besi 2200 evo advanced— Same function class: Packaging & Bonding, nullCompare in depthsource[2]
- MRSI HVM3— Same function class: Packaging & Bonding, nullCompare in depthsource[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kinds of joining methods can this class use?General reference — not yet source-verified
Depending on the process, such machines can support thermal, mechanical, acoustic, or adhesive-based bonding approaches.
Why is alignment important in this class of machine?General reference — not yet source-verified
Alignment ensures that the part is placed onto the intended bonding area and that electrical and mechanical connections are formed in the correct location.
Not publicly documented
The following facts about the LinDA are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the LinDA are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the LinDA are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the LinDA are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the LinDA is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the LinDA are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]dynamicmos.com — dynamicmos.comdynamicmos.com
Last updated Oct 5, 2026.
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