ASM
Eagle XP 8
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM Eagle XP 8 is a 300mm plasma-enhanced atomic layer deposition (PEALD) tool. The Eagle XP 8 can be configured with up to four Dual Chamber Modules (DCM) for eight chambers in a compact footprint. The Eagle XP 8 is capable of dielectric PEALD processes including low-temperature spacers for multiple patterning.[1][2]
What it is
General reference — not yet source-verifiedThe ASM Eagle XP8 is a production platform for plasma-enhanced atomic layer deposition (PEALD) used in semiconductor manufacturing. PEALD systems deposit thin films with atomic-level thickness control by alternating precursor and plasma reactant pulses. The Eagle XP8 is designed for high-volume manufacturing of advanced logic and memory devices.
How it works
General reference — not yet source-verifiedAtomic layer deposition relies on sequential, self-limiting surface reactions between gaseous precursors and a substrate. In PEALD, a plasma replaces one of the chemical reactants, allowing film formation at lower temperatures while maintaining conformality and density. The process repeats in cycles to build up the film thickness one atomic layer at a time.
Applications
The Eagle XP8 is applied to a broad range of dielectric PEALD processes. Key applications include low-temperature spacers for Spacer Defined Multiple Patterning (SDMP), conformal liners, spacer layers, and etch stop layers. Other uses include through-silicon via (TSV) isolation liners and films for conformal doping.[1][2]
What do the numbers mean?
Wafer handling1
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the wafer size supported by the Eagle XP8?
What does DCM stand for and how many can the system use?
DCM stands for Dual Chamber Module. The Eagle XP8 can be configured with up to four DCMs, enabling a total of eight chambers.[1][2]
Not publicly documented
The following facts about the Eagle XP 8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Eagle XP 8 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Eagle XP 8 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Eagle XP 8 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Eagle XP 8 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Eagle XP 8 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]asm.com — asm.comasm.com
- [2]ASM Eagle XP8 PEALD Tool — atomiclayerdeposition.comatomiclayerdeposition.com
- [3]Equipment inventory listing
Last updated Sep 26, 2026.
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