UVision 3 Brightfield

The Applied Materials UVision 3 is a deep ultraviolet (DUV) brightfield wafer inspection system. The UVision 3 was introduced as a tool for critical-defect detection sensitivity required for 45 nm front-end-of-line (FEOL) and immersion lithography processes. The system also addresses 32 nm memory development. The UVision 3 is configured for 300 mm wafer handling.^[3][4]

The UVision 3 system uses a multi-beam deep ultraviolet (DUV) laser architecture that triples the number of laser beams scanning the wafer compared to previous generations. The UVision 3 employs a sensitive photomultiplier tube (PMT) detector and variable polarization to enhance contrast. The system features two new imaging modes in the illumination and collection paths to address contrast versatility required for immersion lithography. Innovative algorithms provide high defect accuracy and stitch-to-stitch detection.^[3]

The UVision 3 is targeted for front-end-of-line (FEOL) applications and immersion lithography processes at 45 nm and below. The UVision 3 is also used for 32 nm memory development. The system is designed to support double patterning lithography schemes.^[3]

The UVision 3 offers sensitivity down to 20 nm for critical defects, enabling detection of defects in immersion lithography layers. The UVision 3 provides 40% faster throughput than competing systems, making it suitable for volume production. The system is used by leading-edge memory and immersion lithography manufacturers.^[3]