Applied Materials
The Applied Materials Centura 5200 is a rapid thermal process (RTP) reactor. The Applied Materials Centura 5200 uses a standard system controller and operates on 208 VAC, 3-phase power. The Applied Materials Centura 5200 is Y2k compliant and features a UHP gas panel.[1]

The Applied Materials Centura 5200 is a rapid thermal processing (RTP) reactor designed for single-wafer thermal treatment in semiconductor manufacturing. The system is configured as a single-chamber unit and operates on 208 VAC three-phase power. The Centura 5200 uses an Ebara A30 loadlock pump and is equipped with a UHP-grade (ultra-high purity) gas panel. The system is Y2K compliant and uses a standard system controller.[1]
Rapid thermal processing reactors heat a single wafer to high temperatures using arrays of tungsten-halogen lamps or other radiant heat sources. The wafer is rapidly brought to the target temperature, held for a short duration (typically seconds), and then cooled quickly. Temperature uniformity is maintained through real-time pyrometry and closed-loop lamp power control inside a cold-wall quartz chamber.
The Centura 5200 RTP reactor is used in front-end-of-line (FEOL) and back-end-of-line (BEOL) process flows. In FEOL, it is typically placed after ion implantation to activate dopants and repair crystalline damage. In BEOL, it can be used for silicide formation (e.g., nickel or cobalt silicide) and for annealing of high-k dielectrics or metal gates.
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The following facts about the Centura 5200 RTP Reactor are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura 5200 RTP Reactor are on record.
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Last updated Sep 24, 2026.
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