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Advantest

T 5377

Test & ProbeAdvantest T 5377 family
Research Quality: 50% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

T 5377 — Inventory photo
Fig. 01T 5377Inventory photo[1]

What it is

The Advantest T 5377 is a test and probe system for semiconductor devices.[1][2]

The T 5377 is a dual test head configuration.[1]

How it works

The T 5377 supports DRAM, SDRAM, ADDR devices, SRAM, Flash memory, Direct RDRAM, EPROM, and mask ROM.[2]

Where it fits in the process flow

General reference — not yet source-verified

The T 5377 fits in semiconductor electrical test and wafer probing flows.

A probe system generally sits after front-end device formation and before final package-level or system-level qualification.

Applications

The T 5377 is used for memory devices including DRAM, SDRAM, ADDR devices, SRAM, Flash memory, Direct RDRAM, EPROM, and mask ROM.[2]

What do the numbers mean?

Power & electrical2

Test speed (single data rate)
143 MHz[2]
Accurate?
Test speed (DDR mode)
286 MHz[2]
Accurate?

Wafer handling1

Wafer size support
300 mm[2]
Accurate?

Optics & imaging1

Target devices
DRAM, SDRAM, DDR devices, SRAM, Flash memory, Direct RDRAM, EPROM, mask ROM[2]
Accurate?

Configuration & options6

Dual Test Head[1]
Accurate?
Maximum number of devices tested in parallel
256 DUTs per system[2]
Accurate?
Number of test heads
Up to 2 stations[2]
Accurate?
DC units per station
Up to 64[2]
Accurate?
Programmable loads per station
Up to 256[2]
Accurate?
Options
MRA4 or AFM[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Test speed (single data rate)143 MHz[2]
  • Test speed (DDR mode)286 MHz[2]

Parts & consumables

Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.

  • Advantest T 5581 / T 5375 / T 5377 BoardIn Productionsource[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

How does a memory tester differ from a logic tester?General reference — not yet source-verified

Memory testers are optimized for testing dense arrays of memory cells with repetitive patterns, while logic testers focus on testing digital logic devices with complex state machines and interfaces. Memory testers typically have many more parallel test channels for addressing multiple memory cells simultaneously, and are designed for the specific timing and voltage requirements of memory devices.

What is the typical test throughput for a system like this?General reference — not yet source-verified

Throughput varies widely based on device complexity, test program length, and parallel test site count. Memory testers can test multiple devices in parallel (site-parallel testing), and throughput is measured in devices per hour. Higher parallel test capability and faster pattern execution directly improve throughput.

What kind of facility infrastructure does a memory tester require?General reference — not yet source-verified

Such systems require cleanroom or controlled lab environments with stable temperature and humidity, adequate electrical power (often three-phase), cooling water circulation, and compressed air. The exact specifications depend on the tester's power consumption and thermal management needs.

Can this tester be used for wafer-level testing?General reference — not yet source-verified

Yes, memory testers of this class are commonly used for wafer sort testing when paired with a prober (a wafer-handling system that steps through individual die). The tester provides the electrical interface to the probe card that contacts the bond pads on each die.

Not publicly documented

The following facts about the T 5377 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the T 5377 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the T 5377 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the T 5377 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the T 5377 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the T 5377 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]web.archive.org — advantest.co.jp (Jun 7, 2007)web.archive.org
  3. [3]Equipment inventory listing
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Last updated Sep 28, 2026.

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