Advantest
B 6700 ES
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Advantest B 6700 ES is a test and probe tool.[1]
What it is
How it works
General reference — not yet source-verifiedA wafer prober positions a semiconductor wafer on a chuck that can move in X, Y, and Z axes to align individual die under a set of probe needles. The probe card contains an array of fine needles arranged to match the bond pad pattern of the device under test. When the chuck raises the wafer, the needles contact the pads, and the test head delivers electrical signals to exercise the circuit. The system measures output signals to determine whether the die passes or fails the test.
Where it fits in the process flow
General reference — not yet source-verifiedWafer probers operate after the wafer fabrication process is complete and before the wafer is diced into individual chips. The equipment is used during the final test step in wafer fabrication, often referred to as wafer sort or chip probing. Wafer probers allow early identification of defective die, enabling only known-good die to proceed to packaging and final test.
Applications
General reference — not yet source-verifiedSemiconductor test and probe equipment is used to test a wide range of devices, including logic circuits, memory chips, microprocessors, and analog or mixed-signal devices. The same class of equipment can also be used for parametric testing, where electrical characteristics of the wafer's process control monitors are measured. Probe stations are also employed in failure analysis and device characterization during development.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the B 6700 ES are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the B 6700 ES are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the B 6700 ES are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the B 6700 ES are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the B 6700 ES are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the B 6700 ES are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]B 6700 ES — Advantest | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [2]Equipment inventory listing
Last updated Sep 28, 2026.
