Waferpedia

Tool family

SUSS MicroTec XBC300 Gen2 D2W/W2W

The SUSS XBC300 Gen2 D2W/W2W is a high-precision bonding system built on a scalable, modular platform for temporary, permanent, and hybrid bonding.

Models in this family

  1. The SUSS XBC300 Gen2 D2W/W2W is a high-precision bonding system built on a scalable, modular platform for temporary, permanent, and hybrid bonding.

    Cited variants

    DesignationGenerationVintageChangesSource
    XBC300 Gen2 D2W——Supports only die-to-wafer (D2W) bonding on the XBC300 Gen2 platform.suss.com[1]

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]suss.comsuss.com