SUSS MicroTec SB 6 E

Models in this family

1. SB 6 E

   The SUSS SB 6 E is a semi-automatic substrate bonder designed for aligned and unaligned wafer, substrate, and chip bonding using thermo-compression, anodic, fusion, adhesive, and related technologies.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   SB8e	—	—	Larger wafer size: 200 mm and 150 mm o/ (instead of 150 mm o/ to 10 mm x 10 mm for SB6e)	coltronics.com.au[1]

Sources