Waferpedia

Tool family

Esec Esec 2100 hS i

The Esec 2100 hS i is a die bonder for epoxy die attach applications. The Esec 2100 hS i is described as a 3rd generation 300 mm high speed platform.

Models in this family

  1. Esec 2100 hS i3rd generation

    The Esec 2100 hS i is a die bonder for epoxy die attach applications. The Esec 2100 hS i is described as a 3rd generation 300 mm high speed platform.