Waferpedia

Tool family

Applied Materials Producer

Models in this family

  1. Applied Materials Producer is a plasma CVD (chemical vapor deposition) system stated to be available for 8-inch wafers.

    Cited variants

    DesignationGenerationVintageChangesSource
    Producer Etcher eXT Poly——12-inch etcher variant for poly processingEquipment inventory listing[1]
    Producer Etcher eXT Dielectric——12-inch etcher variant for dielectric processingEquipment inventory listing[2]
  2. Producer GTproduced 2006–

    Cited variants

    DesignationGenerationVintageChangesSource
    Applied Materials Producer GT Etcher—2014Listed with Chamber A: SiCoNi and Chamber B: Frontier Etch, plus a missing-parts list.Equipment inventory listing[3]
    Applied Materials (AMAT) Producer GT APF—2009Configured as APF PECVD deposition equipment with three APF TWIN chambers.macquarie.com[4]
  3. Applied Materials Producer GT 3 RTP is a rapid thermal process system for 12-inch wafers.

  4. Applied Materials Producer GT APF is a PECVD (plasma-enhanced chemical vapor deposition) system.

  5. Applied Materials Producer GT DARC is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

  6. The Applied Materials Producer GT HARP is a chamber used for sub-atmospheric chemical vapor deposition (SACVD) HARP (High Aspect Ratio Process) USG (undoped silicate glass) deposition on 300 mm wafers.

  7. The Applied Materials Producer III is a chemical vapor deposition (CVD) system.

  8. Applied Materials Producer S is a PECVD (plasma-enhanced chemical vapor deposition) system for 8-inch wafers.

  9. The Applied Materials Producer SE is a 300mm wafer chemical vapor deposition (CVD) system, offered in both standard CVD and plasma-enhanced CVD (PECVD) configurations.

All entries

  1. ProducerApplied Materials

    Applied Materials Producer is a plasma CVD (chemical vapor deposition) system stated to be available for 8-inch wafers.

    CategoryDeposition
    9 specs
  2. Producer GTApplied Materials
    CategoryEtch
    31 specs
  3. Producer GT 3 RTPApplied Materials

    Applied Materials Producer GT 3 RTP is a rapid thermal process system for 12-inch wafers.

    CategoryThermal / Diffusion
    5 specs
  4. Producer GT APFApplied Materials

    Applied Materials Producer GT APF is a PECVD (plasma-enhanced chemical vapor deposition) system.

    CategoryDeposition
    8 specs
  5. Producer GT DARCApplied Materials

    Applied Materials Producer GT DARC is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

    CategoryDeposition
    15 specs
  6. Producer GT HARPApplied Materials

    The Applied Materials Producer GT HARP is a chamber used for sub-atmospheric chemical vapor deposition (SACVD) HARP (High Aspect Ratio Process) USG (undoped silicate glass) deposition on 300 mm wafers.

    CategoryDeposition
    20 specs
  7. Producer GT MetalApplied Materials
    CategoryDeposition
    1 spec
  8. Producer IIIApplied Materials

    The Applied Materials Producer III is a chemical vapor deposition (CVD) system.

    CategoryDeposition
    4 specs
  9. Producer SApplied Materials

    Applied Materials Producer S is a PECVD (plasma-enhanced chemical vapor deposition) system for 8-inch wafers.

    CategoryDeposition
    2 specs
  10. Producer SEApplied Materials

    The Applied Materials Producer SE is a 300mm wafer chemical vapor deposition (CVD) system, offered in both standard CVD and plasma-enhanced CVD (PECVD) configurations.

    CategoryDeposition
    45 specs

Sources

Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]macquarie.commacquarie.com