Waferpedia

Comparison ledger

2CKversus3CK

Temescal 2CK, Temescal 3CK, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2CKTemescal
3CKTemescal
OEMTemescalTemescal
CategoryE-gunE-gun
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTemescal 2CKTemescal 3CK
Cited variants
  • Temescal 3CK[1]
  • Temescal 2CK[1]
  • Temescal 1CK[1]
  • 3CK SuperSource[1]
  • 1CK SuperSource[1]
Specifications
Model2CK SuperSource[1]3CK SuperSource[1]
Rated powerup to 10 kW[1]Up to 12 kW[1]
Crucible coverRemovable cover[1]Removable crucible cover[1]
Drive optionsSide or bottom drive[1]Side drive or bottom drive[1]
Deflection270°[1]270 degrees[1]
Weight23.5 lbs (10.7 kg)[1]23.5 lbs. (10.7 kg)[1]
Max bakeout temperature302 °F (150 °C)[1]302 F (150 C)[1]
Acceleration voltage4–10 kV[1]4-10 kV[1]
Operating pressureMaximum 5 × 10^-4 torr (6.7 × 10^-4 mbar); minimum 1 × 10^-4 torr (1.33 × 10^-4 mbar)[1]—
Filament current70 A at 12 V ac[1]70 A at 12 V ac[1]
Emission current0–1.5 A at 4–10 kV dc (8 kW max.)[1]0-1.5 A at 4-10 kV dc (8 kW max.)[1]
Cooling water maximum temperature68 °F (20 °C)[1]—
Cooling water flow rate2.75 gpm (0.17 l/sec.)[1]—
Cooling water max inlet pressure100 psi (6.89 bar)[1]—
Cooling water min delta pressure50 psi (3.45 bar)[1]—
High-voltage feedthroughsTwo HV feedthroughs rated for 12 kV at 70 A[1]—
Octal feedthroughOne octal feedthrough rated for 110 V at 3 A per lead[1]—
Dual-pass feedthroughOne dual-pass feedthrough with 3/8-in. (9.5-mm) OD tubes[1]—
Rotary feedthroughOne rotary-motion feedthrough with 1/4-in. (6.4-mm) diameter shaft[1]—
Type—Electron beam deposition source / e-gun[1]
Crucible configurations stated for 3CK—4 x 40cc; 4 x 60cc; 6 x 20cc; 6 x 25cc; 4 x 25cc + 2 x 15cc; 5 x 25cc + 1 x 15cc; 325 cc skillet[1]
Dimensions—See illustration[1]
Rotation torque—10 in.-lbs. (11.5 kg-cm)[1]
Max power—8 kW[1]
Operating pressure maximum—5 x 10^-4 torr (6.7 x 10^-4 mbar)[1]
Operating pressure minimum—1 x 10^-4 torr (1.33 x 10^-4 mbar)[1]
Spot size/shape—From tight oval to diffuse oblong[1]
Evaporation rate example—25 kA of aluminum at 10-in. (254-mm) source-to-substrate distance[1]
Sweep capability—Longitudinal and lateral when operated with a beam sweep controller[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org