Comparison ledger
SUSS MicroTec MA 150 E Mask, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MA 150 E MaskSUSS MicroTec | 1000 FamilyUltratech |
|---|---|---|
| OEM | SUSS MicroTec | Ultratech |
| Category | Lithography | Lithography |
| Wafer size | Wafer Thickness Measurement | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec MA 150 | Ultratech 1000 Family |
| Specifications | ||
| Configuration | Gen 2[1] | — |
| Wafer size | Wafer Thickness Measurement[1] | — |
| Prealigner Type | XRS[2] | — |
| Operating System | Windows 2000[2] | — |
| Lamphouse | 1000 Watt Lamphouse[2] | — |
| Exposure Optics | UV400 Optics (365nm/405nm exposure)[2] | — |
| Power Supply | CIC1200[2] | — |
| Microscope | DVM6 Microscope[2] | — |
| Single Objective | Configured to fit customer requirement (5x, 10x, or 20x)[2] | — |
| Vacuum Chuck | Configured to fit customer requirements[2] | — |
| Maskholder | Configured to fit customer requirements[2] | — |
| OEM | SUSS[1] | — |
| Model | MA 150 E[1] | — |
| Equipment type | Mask Aligner[1] | — |
| Equipped with | Wafer Thickness Measurement[1] | — |
| Alignment mode | Topside Alignment (TSA)[2] | — |
| Operation mode | Automatic or Manual Mode[2] | — |
| Cassette operation | Cassette to cassette operation[2] | — |
| Alignment system | AL3000 Automatic Alignment[2] | — |
| Pattern recognition software | Cognex 8100 Pattern Recognition Software[2] | — |
| Exposure modes | Hard, Soft, Proximity, and Vacuum Contact Exposure Modes[2] | — |
| System power | 208/230V[2] | — |
| Tool type | — | Photolithography step-and-repeat 1X stepper[3] |
| Optical design | — | Wynne Dyson[3] |
| Magnification | — | 1X[3] |
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