Waferpedia

Comparison ledger

XeF2versus1512e

SPTS XeF2, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
XeF2SPTS
1512eTegal
OEMSPTSTegal
CategoryEtchEtch
Wafer sizeUp to 6-inch wafers—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2013 Acquisition of XACTIX, Inc. · 2013 XACTIX acquisition—
Control system——
Generation——
FamilySPTS XeF2Tegal 1512e
Specifications
Etch typeIsotropic etch[1]—
SelectivityOver 1000:1 between Si/photoresist, Si/SiO2, and Si/SiN[1]—
Gas flow modesContinuous and pulsed gas flow[1]—
Operating temperatureRoom temperature[1]—
PlasmaNo plasma[1]—
Substrate sizeUp to 6-inch wafers[1]—
Isotropic etch materialsSi, Mo, Ge, W, C[1]—
Tool type—Industrial RIE plasma etcher system[2]
Stated configuration—With modules assembly for CI-4222[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]aggiefab.tamu.eduaggiefab.tamu.edu
  2. [2]semistarcorp.comsemistarcorp.com