Comparison ledger
PR Hoffman 108T, Semitool 4300 S SRD, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 108TPR Hoffman | 4300 S SRDSemitool |
|---|---|---|
| OEM | PR Hoffman | Semitool |
| Category | CMP | CMP |
| Wafer size | up to 12 in wafers | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | PR Hoffman 108T | Semitool 4300 S SRD |
| Specifications | ||
| carrier type listing | 108T 9B - S/F / Lapmaster LSP-9 / etc.[1] | — |
| machine class | for double-sided planetary lapping & polishing machines[1] | — |
| wafer sizes stated on insert-carrier page | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[1] | — |
| maximum carrier diameter stated on insert-carrier page | up to 33 in diameter[1] | — |
| maximum carrier diameter stated on lapping-carrier page | up to 48 in diameter[2] | — |
| Configuration | — | Single stack[3] |
| Voltage | — | 110V ready system[3] |
| Wafer size | — | <25 particles @ .25um / 200mm wafer[3] |