Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 7416A, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 7416AWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 7416A |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Equipment type | — | Wire bonder[2] |
| Bonding method | — | Thermocompression wedge[2] |
| Model | — | 7416A[3] |
| Wire bond style | — | Wedge[4] |
| Operation | — | Manual[4] |
| Channels | — | 2 (CHAN 1 and CHAN 2)[4] |
| Input voltage | — | 115V AC, 50/60 Hz[4] |
| Wire range | — | 0.5 mil (12 microns) to 2 mil (50 microns)[3] |
| Form factor | — | Benchtop[4] |
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