Waferpedia

Comparison ledger

Rainbow 4526 XLversus100 ICP Fluorine

Lam Research Rainbow 4526 XL, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Rainbow 4526 XLLam Research
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research Rainbow 4526Oxford Instruments 100 ICP Fluorine
Specifications
ConfigurationOxide Etch[1]—
Wafer typeJeida flat[1]—
Valve typeVAT 65[1]—
SoftwareEnvision 1.6.1-005[1]—
RFENI-GHW50 / ENI-2MHz[1]—
RobotHarmonic Drive[1]—
LoaderHine Indexers 38A[1]—
LoadlockEntrance & Exit LL[1]—
Turbo PumpHGP Pump[1]—
ControllersHGP / VAT 65[1]—
ManufacturerLam Research[1]—
ModelRainbow 4526 XL[1]—
CategoryEtch[2]—
Tool typePlasma etcher[1]—
ProcessOxide etch[1]—
Wafer sizes6 inch, 8 inch[1]—
ESCPresent[1]—
EndpointMonochromator Endpoint[1]—
RF cartPresent[1]—
Gas chamberPresent[1]—
Ar485.0 sccm[1]—
CF420.0 sccm[1]—
CHF320.0 sccm[1]—
C4F819.5 sccm[1]—
CO200.0 sccm[1]—
O2 LOW20.0 sccm[1]—
O2 HIGH1000.0 sccm[1]—
N2100.0 sccm[1]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[3]
Cryo DRIE etch rate—up to 5 µm/min[3]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[3]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nanofab.utah.edunanofab.utah.edu