Comparison ledger
KLA Surfscan SP 2 Particle Defect, Rudolph E25, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | E25Rudolph | |
|---|---|---|
| OEM | KLA | Rudolph |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2006– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA Surfscan | Rudolph E25 |
| Specifications | ||
| P/N | 0074965-000[1] | — |
| Configuration | Includes HDD[1] | — |
| Handler Type | Vacuum 300mm/200mm[2] | — |
| Defect sensitivity | <37 nm on polished bare silicon[1] | — |
| Technology nodes | 90, 65, & 45 nm[1] | — |
| Inspection modes | Standard Throughput Inspection Mode, High Sensitivity Inspection Mode[1] | — |
| Illumination | Oblique Illumination; DF (Oblique, Normal) ST and LT Mode[2] | Brightfield and darkfield illumination available[3] |
| Collection | Wide & Narrow[2] | — |
| Software version | 5.40[2] | — |
| Included licenses | Optical Filter, Enhanced XY Coordinates, 2 mm Edge Exclusion, Standard Classification Package, LPD-N Classification, LPD-ES Classification, Grading & Sorting, Haze, Haze Analysis & Normalization, Haze Line Classification, IDM 2011 Vintage[1] | — |
| Operating system | Microsoft Windows XP[1] | — |
| Wafer handler | 300 mm Phoenix Dual FIMS Vacuum Wafer Handler (PP) Ballroom Configuration; Phoenix 2.0 Handler[1] | — |
| Wafer size | Includes 300 mm Phoenix Dual FIMS Vacuum Wafer Handler (PP)[1] | 300 mm[3] |
| Software vs | 5.40[2] | — |
| OEM | KLA[1] | — |
| Model | Surfscan SP 2[1] | — |
| Wafer Sizes | 12 inch[1] | — |
| Particle sensitivity | <37 nm defect sensitivity on polished bare silicon[1] | — |
| Illumination mode | Oblique illumination[1] | — |
| Included components | UV Laser; defect map & histogram with zoom; iMicroView measurement capability; SURFimage; Real-Time Defect Classification (RTDC); Microsoft Windows XP Operating System[1] | — |
| Handler | 300 mm Phoenix Dual FIMS Vacuum Wafer Handler (PP) Ballroom Configuration (Standard)[1] | — |
| Inspection type | — | Automated wafer edge top and edge normal inspection[3] |
| Throughput | — | Greater than 80 WPH[3] |
| Certification | — | Class 1 certified[3] |
| Set-up time | — | Approximately 10 minutes to be fully optimized and production ready[3] |
| Defect imaging | — | On-the-fly color defect image capture[3] |
| Detection and classification | — | Automatically detects and classifies defects on the entire wafer edge, from the edge exclusion area to the bottom bevel[3] |
| Defect detection and classification | — | Automatically detects and classifies defects on the entire wafer edge, from the edge exclusion area to the bottom bevel[4] |
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