Comparison ledger
KLA 0035235-003 MMD Head, Zeiss 1540EsB, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1540EsBZeiss | |
|---|---|---|
| OEM | KLA | Zeiss |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | Zeiss 1540EsB |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| System type | — | FIB/SEM system[2] |
| Electron column | — | FESEM electron column[2] |
| Imaging resolution | — | resolution approaching the 2 nm range[2] |
| Ion column | — | Ga ion column[2] |
| Milling capability | — | allows for milling (sputtering) of materials from the sample[2] |
| Deposition materials | — | Pt, W, and SiOx[2] |
| Gas Injection System etch gases | — | XeF2 and H2O[2] |
| Detector options | — | multiple detector options for different imaging modes[2] |
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