Comparison ledger
EV Group 101, Tokyo Electron Lithius Pro, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | Lithius ProTokyo Electron |
|---|---|---|
| OEM | EV Group | Tokyo Electron |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2025 Announcement of LITHIUS Pro DICE |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | Tokyo Electron Lithius |
| Cited variants | — | |
| Specifications | ||
| OEM | EV Group[3] | — |
| Model | 101[3] | — |
| Equipment name | EVG 101 Spray Coater[3] | — |
| NEMO ID | evgspraycoat[3] | — |
| Training required | EVG 101 Training[3] | — |
| Training duration | 1.50 hours[3] | — |
| Processing technique | Resist Spray Coat (manual)[3] | — |
| Cleanliness | "All"[3] | — |
| Location | SNF Paul G Allen L107 Cleanroom[3] | — |
| Wafer diameter (substrate size) | up to 300 mm[4] | — |
| Available modules | Spin coat / OmniSpray® / develop[4] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[4] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[4] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[5] | — |
| Cleanliness group (at SNF) | "All"[3] | — |
| Configuration | — | Immersion COT and DEV[6] |
| Equipment type | — | Coater / Developer[6] |
| Process description | — | Immersion COT and DEV[6] |
| Pre-/post-exposure process | — | With rinse process at pre-/post exposure[6] |
| FOUP exchanger | — | 1 FOUP exchanger[6] |
| Application | — | Lithography process (ArF Immersion, ArF, KrF, i-line)[1] |
| Throughput | — | Maximum 250 wph capable in future; 200 wph capability with future upgradeability to 250 wph[1] |
| Integration | — | Optimized integration with the exposure tool for maximizing litho cell throughput[1] |
| Chemical consumption | — | Drastically reduced chemical consumption[1] |
| Wafer Size | — | 300mm[2] |
| Throughput (LITHIUS Pro V) | — | 200 wph (upgradeable to 250 wph)[1] |
| Applications | — | ArF Immersion, ArF, KrF, i-line lithography[1] |
| Date of Manufacture (example unit) | — | 2010-04-15[7] |
| Software Version (example unit) | — | 300.0.88.3[7] |
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