Comparison ledger
EV Group 101, GCA 8500 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | 8500 WaferGCA |
|---|---|---|
| OEM | EV Group | GCA |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | GCA 8500 Wafer |
| Specifications | ||
| OEM | EV Group[1] | GCA[4] |
| Model | 101[1] | — |
| Equipment name | EVG 101 Spray Coater[1] | — |
| NEMO ID | evgspraycoat[1] | — |
| Training required | EVG 101 Training[1] | — |
| Training duration | 1.50 hours[1] | — |
| Processing technique | Resist Spray Coat (manual)[1] | — |
| Cleanliness | "All"[1] | — |
| Location | SNF Paul G Allen L107 Cleanroom[1] | — |
| Wafer diameter (substrate size) | up to 300 mm[2] | — |
| Available modules | Spin coat / OmniSpray® / develop[2] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[2] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[3] | — |
| Cleanliness group (at SNF) | "All"[1] | — |
| Configuration | — | 5 Axis[4] |
| Equipment type | — | Commercial wafer stepper[5] |
| Reduction ratio | — | 5x[4] |
| Exposure source | — | i-line[5] |
| Resolution capability | — | Sub-micron features[6] |
| Axis configuration | — | 5-axis[4] |
| Wafer diameter | — | 150 mm[5] |
| Wafer geometry supported | — | 1-flat, 2-flat, notched, no-flat[5] |
| Wafer materials supported | — | Silicon, silicon on insulator[5] |
| Wafer thickness range | — | 500–700 µm[5] |
| Batch size | — | 1 wafer (150 mm)[5] |
| Demonstrated wafer use | — | 6-inch silicon-on-insulator wafer[6] |
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