Comparison ledger
Esec Datacon 2200 evo advanced, MRSI 505 Die Attach, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 505 Die AttachMRSI | |
|---|---|---|
| OEM | Esec | MRSI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 4" | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 3rd generation | — |
| Family | Esec Datacon 2200 evo advanced | MRSI 505 Die Attach |
| Cited variants | — | |
| Specifications | ||
| Bonding method | Epoxy[1] | — |
| Cycle time | 120 ms with Liquid Cooling option[1] | — |
| Bonding accuracy | 20 µm @ 3σ (15 µm option)[1] | — |
| Wafer size | 4" to 12" (on 8" or 12" wafer frames)[1] | — |
| Die size | 0.25 mm (with Small Die Kit) to 20 mm[1] | — |
| Leadframe size | Length: 90 to 300 mm; Width: 23 to 100 mm[1] | — |
| Machine dimensions | 1785 x 1448 x 1400 mm (W x D x H)[1] | — |
| Wafer Size | — | 4", Also used on Substrate 3x5" and Chip on Tape[2] |
| Configuration | — | Comes with Standard Boats / Cassettes[2] |
| Also used on Substrate | — | 3x5" and Chip on Tape[2] |
| Comes with Standard Boats / Cassettes | — | Yes[2] |
| Vintage (listed unit) | — | 2001[3] |
| Description | — | Die Attach/ Multichip Module[3] |
| Version | — | assembly[3] |
| Manufacturer | — | MRSI[4] |
| Model | — | 505[4] |
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