Waferpedia

Comparison ledger

3100 Plusversus10490

Esec 3100 Plus, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMEsecWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEsec 3100 PlusWest Bond 10490
Specifications
TypeWire bonder[1]—
DescriptionGold wire bonder[2]Convertible bonder, wedge to ball[5]
MicroscopeTwo eyepieces[3]—
Control PanelEmergency stop button[3]—
IlluminationAdjustable arm light[3]—
SoftwareWB3100plus wire bonder interface[3]—
Manufacturer—West Bond[4]
Model—10490[4]
Tool type—Convertible bonder[6]
Bonding modes—Wedge bonding and ball bonding[6]
Use—Wire bonding[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]bondztek.combondztek.com
  3. [3]exapro.comexapro.com
  4. [4]Equipment inventory listing
  5. [5]fabsurplus.comfabsurplus.com
  6. [6]waferpedia.comwaferpedia.com