Waferpedia

Comparison ledger

1034versusSP4

Electroglas 1034, Signatone SP4, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1034Electroglas
SP4Signatone
OEMElectroglasSignatone
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyElectroglas 1034Signatone SP4
Specifications
Material—Mold-injected Delrin[1]
Operating temperature—Room temperatures[1]
Tip configuration—Four tips in a straight line configuration[1]
Spacing options—40 mils, 50 mils, or 62.5 mils between probe tips[1]
Spring pressure options—45 grams, 85 grams, or 180 grams per tip[1]
Tip material options—Osmium or tungsten carbide[1]
Standard probe tip size—1.6 mil diameter[1]
Optional blunt tip radii—R=.005 for 5 mil diameter tips; R=.010 for 10 mil diameter tips[1]
Body material—Mold-injected Delrin[1]
Tip spacing options—40, 50, 62.5 mils[1]
Standard tip diameter—1.6 mil[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org