Comparison ledger
Disco DFL 7160 Automatic, Disco DFL 7160 Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DFL 7160 AutomaticDisco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFL 7160 | Disco DFL 7160 |
| Cited variants |
| — |
| Specifications | ||
| Configuration | 1 Cassette port[2] | Non-operational[4] |
| Wafer Size | 12 inch[2] | — |
| Cassette Ports | 1[2] | — |
| Dicing | Yes[3] | — |
| Circular Ring Cutting of Taiko Wafers | Yes[3] | — |
| Automation | Automatic[1] | — |
| Equipment type | — | Fully automatic laser saw[5] |
| Max. workpiece size | — | Φ300 mm[5] |
| Processing method | — | Ablation[5] |
| Laser wavelength | — | 355 nm[6] |
| Laser maximum power | — | 18 W[6] |
| X-axis processing range | — | 310 mm[5] |
| Y-axis processing range | — | 310 mm[5] |
| X-axis moving speed | — | 0.1–600 mm/s[5] |
| X-axis index step | — | 0.0001 mm[5] |
| Positioning accuracy | — | 0.003/310 mm (single error), 0.002/5 mm[5] |
| Z-axis moving resolution | — | 0.00005 mm[5] |
| Repeatability accuracy | — | 0.002 mm[5] |
| θ-axis max. rotating angle | — | 380 deg[5] |
| Equipment dimensions | — | 1,200 × 1,550 × 1,800 mm[5] |
| Equipment weight | — | Approx. 1,750 kg[5] |
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