Waferpedia

Comparison ledger

11000versusSummit 11000

Cascade Microtech 11000, Cascade Microtech Summit 11000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11000Cascade Microtech
Summit 11000Cascade Microtech
OEMCascade MicrotechCascade Microtech
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCascade Microtech 11000Cascade Microtech Summit 11000
Specifications
ConfigurationWith antivibration table[1]—
Z-lift range—5.5 mm linear lift with <2 µm repeatability[3]
X-Y stage travel—203 mm × 203 mm[3]
X-Y resolution—0.2″ per turn[3]
Wafer Size—8 inch (200mm)[3]
X-Y Stage Resolution—0.2 inch per turn[3]
Z-lift Range—5.5 mm linear lift[3]
Z-lift Repeatability—< 2 μm[3]
Maximum Frequency (RF)—110 GHz[4]
Wafer Chuck—6-inch/150mm RF/Microwave chuck (Ni)[5]
X-Y Stage Resolution (alternative)—0.1 μm resolution[5]
Z Travel—5mm with 1 μm resolution[5]
Bridge Travel (X)—6-inch X axis travel (+/- 3-inch from center of travel)[5]
Bridge Travel (Y)—8-inch Y axis travel (+/- 4-inch from center of travel)[5]
Bridge Z-lift—3-inch linear manual Z-lift[5]
Supported wafer size—8 inch (200 mm)[3]
X-Y stage resolution (manual)—0.2″ per turn[3]
X-Y travel resolution—0.1 µm[5]
Large area bridge X travel—6 inch[5]
Large area bridge Y travel—8 inch[5]
Large area bridge Z-lift—3 inch linear manual[5]
Maximum on-wafer RF frequency—110 GHz[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org
  5. [5]1spectrum.com1spectrum.com