Waferpedia

Comparison ledger

20 36 SurfaceversusDAD3221

Blanchard 20 36 Surface, Disco DAD3221, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
DAD3221Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—150mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DAD3221
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]—
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Type—automatic dicing saw[2]
Wafer size—100, 150 mm wafers[2]
Setup—non-contact setup[2]
Blade monitoring—blade breakage detector[2]
Cutting functions—circle cut for edge trimming or down sizing[2]
Particle/ESD mitigation—CO2 injector to prevent particle adhesion and electrostatic discharge damage[2]
Alignment aids—pattern recognition system; automatic micro-alignment[2]
Equipment type—Automatic dicing saw[2]
Wafer / substrate size—100, 150 mm wafers[2]
Substrate size—up to 150mm diameter[3]
Max. workpiece size—Φ6 inch (150 mm × 150mm user-specified specification)[4]
Non-contact setup—Yes[2]
Blade breakage detector—Yes[2]
Circle cut—For edge trimming or downsizing[2]
CO2 injector—Prevents particle adhesion and electrostatic discharge damage[2]
Pattern recognition system—Yes[2]
Automatic micro-alignment—Yes[2]
Spindle layout—Single[4]
Standard rated output—2.0 kW at 40,000 min-1[4]
Optional rated output—1.8 kW at 60,000 min-1[4]
Equipment dimensions—490 × 870 × 1,670 mm[4]
Equipment weight—Approx. 420 kg[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]epfl.chepfl.ch
  3. [3]epfl.chepfl.ch
  4. [4]disco.com.sgdisco.com.sg