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Comparison ledger

18 D Surfaceversus840

Blanchard 18 D Surface, Disco 840, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
840Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco 840
Cited variants—
Specifications
Voltage416 V[2]—
Phase3 Phase[2]—
Cycles50[2]—
Control Voltage110[2]—
MakeBlanchard[2]—
Model18 D[2]—
Asset #153970[2]—
Power416 V, 3 phase[2]—
Wafer size range—4–8 inch[1]
Spindle speed—1000–7000 rpm[1]
Vertical stroke—110 mm[1]
Planarity accuracy within wafer—0.0015 mm[1]
Chuck table type—Porous vacuum chuck[1]
Grinding wheel diameter—8 inch[1]
Number of cassettes—2[1]
Number of spindles—2 (independently adjustable)[1]
Dimensions (W × D × H)—1050 × 2150 × 1710 mm[1]
Electrical supply—200 V, 3 phase, 50/60 Hz[1]
CDA supply—0.5–0.8 MPa[1]
DI water supply—0.2–0.3 MPa, 15 l/min or higher[1]
Oil mist filtration system (optional)—Pure Boyd PBH 100[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]s3-alliance.coms3-alliance.com
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]waferpedia.comwaferpedia.com