Comparison ledger
Besi 2200 EVO, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2200 EVOBesi | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Besi | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2200 | Logitech 1 WBS 1 Wafer Substrate |
| Cited variants | — | |
| Specifications | ||
| Configuration | Dual Head[3] | — |
| Power supply | 3 x 400 v[4] | — |
| U nominal | 3 x 400 V[4] | — |
| X/Y placement accuracy | ±10 µm @ 3s[1] | — |
| Theta placement accuracy | ±0.15° @ 3s[1] | — |
| Bond force | 0.5N to 75N programmable[1] | — |
| Throughput (die attach) | up to 7,000 UPH/module[1] | — |
| Throughput (flip chip with dipping) | up to 2,500 UPH/module[1] | — |
| Throughput (flip chip without dipping) | up to 3,200 UPH/module[1] | — |
| Number of working heads | up to 4[1] | — |
| Die size (die attach) | 0.17 mm - 50 mm[1] | — |
| Die size (flip chip) | 0.5 mm - 50 mm[1] | — |
| Die thickness | >50 µm (thinner on request)[1] | — |
| Wafer size | 4" - 12" (SEMI M1)[1] | — |
| Substrate working range | 13" x 8" (325 mm x 200 mm)[1] | — |
| Machine dimensions (LxDxH) | 1,160 mm x 1,225 mm x 1,750 mm[1] | — |
| Weight | 1,300 kg[1] | — |
| Uptime | > 98 %[1] | — |
| Yield | > 99.95 %[1] | — |
| Heated bond head temperature | up to 450°C (optional)[1] | — |
| UV curing wavelengths | 365 nm & 405 nm[1] | — |
| UPH (Die attach) | up to 7,000 UPH/module[1] | — |
| UPH (Flip Chip with dipping) | up to 2,500 UPH/module[1] | — |
| UPH (Flip Chip without dipping) | up to 3,200 UPH/module[1] | — |
| Bond head rotation | 0° - 360°[1] | — |
| UV Curing | 365 nm & 405 nm[1] | — |
| Frame size | FF070, FF105, FF108, FF123; automatic change[1] | — |
| Head configuration | Dual Head[3] | — |
| Wafer Size | — | 6 inch[5] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →